Job Description
Job DescriptionDescription:
Smiths Interconnect Inc. is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that ensure high speed, secure connectivity of critical applications in the defense, aerospace, communications and industrial markets. Our microwave technology is used in radar, communication and surveillance systems that are mission-critical and operate in extreme environments in aerospace and defense. Our microwave components and connectors ensure optimal performance, durability and safety of space satellites. Our semi-conductor test products are used to test highly sophisticated semi-conductors and electronic circuits in communication systems, gaming products and computing devices. Our in-flight antenna systems provide passengers with internet connectivity gate-to-gate on planes around the world. Our connector and cable solutions ensure reliability of critical medical equipment, and safe operation of trains and transport systems. Our products and services are often critical to our customers’ operations, while our proprietary technology and high service levels help create competitive advantage. As such, we welcome colleagues with a curious mind, who are happy with responsibility, and enjoy a challenge.
Smiths Interconnect Inc. is currently seeking a Radio Frequency (RF Engineer) to work in an integrated process team environment, with technical responsibility for all the following, regarding RF/microwave/mmW hardware: research, architecture trades, estimating recurring and non-recurring hardware and activities, analysis, proposals, selection, development, prototyping, verification, customer support, manufacturing support, and sustainment. U.S. Citizenship Required. U.S. Citizenship is required to obtain a Government security clearance.
Responsibilities:
- Have technical responsibility for all aspects of the RF/microwave/mmW hardware within our products, inclusive of UHF through 40GHz
- Participate in the entire product lifecycle for bespoke electronics modules, subsystems, and systems for the aerospace and defense market, including for RADAR, EW, SIGINT, comm, and satcom.
- Work in an integrated process team (IPT) environment, along with program management, quality, manufacturing, supply chain, and other engineering disciplines
- Perform all of the following activities for RF/microwave/mmW hardware: research, architecture trades, estimate recurring and non-recurring hardware and activities, analyze circuits, write technical proposals, select active and passive devices, design single layer substrates and single to multi-layer printed circuit boards, prototyping, verification, customer support, manufacturing support, and sustainment.
Requirements:
Technical Knowledge, Skills and Abilities:
Required:
- Competent in RF linear and non-linear circuit simulation using Cadence AWR or ADS
- Experience with 2.5D and 3D electromagnetic problems and simulation tools
- Experience with multi-layer printed wiring boards (PWB) design and layout up to 20 GHz
- Experience with single layer droids and ceramic layout up to 40GHz
- Experience with chip & wire/bare die design, interconnect, and modeling of interconnect
- Competent in analog DC, AC, and transient circuit simulation using SPICE or derivative
- Competent in RF measurements and design validation procedures
Preferred:
- Experience with MMIC development through 40GHz
- Knowledgeable of system architecture and block diagram planning of up converters and down converters
- Experience with RF system modeling using Cadence AWR VSS
- Knowledgeable of frequency planning and mixer spurious analysis for up and down converters
- Knowledgeable of phase noise requirements, cascaded phase noise performance, and connection to hardware implementation methods
- Knowledgeable with millimeter-wave electronics through 100GHz
- General knowledge of the requirements for and design of microwave sources, LNAs, SSPAs, mixers, filters, and synthesizers
- SSPA design of at least 10W linear from C-band through Ka Band using GaN or GaAs devices
Experience: 5 to 10 years of progressively increasing experience and responsibility for hardware development through at least 20GHz
Education: Bachelor’s degree in electrical engineering (BSEE)
Travel: Up to 10 % required or as business needs require, predominately within continental U.S.
Security: US Citizenship Required. US Citizenship is required to obtain a Government security clearance.